Classification of power supply chips
Classification of power supply chips
Power management integrated circuits include many categories, which are roughly divided into voltage regulator and interface circuits. Voltage regulator includes linear low voltage drop regulator (LDO), and positive and negative output circuit series, in addition to the pulse width modulation (PWM) type of switching circuit.
Due to the progress of technology, the physical size of the digital circuit in the integrated circuit chip is getting smaller and smaller, so the power supply
To the development of low voltage, a series of new voltage regulator emerged.
The interface circuit for power management mainly includes interface driver, motor driver and power field effect transistor
(MOSFET) drivers, high voltage/high current display drivers, etc.
Power management discrete semiconductor devices include some traditional power semiconductor devices, which can be divided into two categories, one includes rectifier and thyristor; The other is transistor type, including power bipolar transistor, power field effect transistor (MOSFET) containing MOS structure and insulated gate bipolar transistor (IGBT), etc.
The leading part of the power management semiconductor is the power management IC, which can be roughly summarized into the following 8 kinds.
1, AC/DC modulation IC, containing low voltage control circuit and high voltage switching transistor;
2, DC/DC modulation IC, including boost/step-down regulator, and charge pump;
3, power factor control PFC preconditioning IC, provide power input circuit with power factor correction function;
4, pulse modulation or pulse amplitude modulation PWM/ PFM control IC, pulse frequency modulation and/or pulse width modulation controller, used to drive the external switch;
5, linear modulation IC(such as linear low voltage drop regulator LDO, etc.), including positive and negative regulators, as well as low voltage drop LDO modulation tube;
6, battery charging and management IC. Including battery charging, protection and power display IC, as well as the battery data communication "intelligent" battery IC;
7, hot swap board control IC(from the working system to insert or pull out the impact of another interface);
8. Switching function ic of MOSFET or IGBT.
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